- SMF系列合金贴膜精密电阻
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产品简介
• 封装大小:0603~2512
• 电阻阻值范围:2mΩ~200mΩ
• 低热电动势
• 低温度漂移系数
• 良好的长期稳定性
• 符合ROHS标准,无卤素 - 产品编号:SMF 所属类型:合金贴膜精密电阻 浏览次数:278391次 咨询热线:400-8456-633
General / 基本特征 | Application / 产品应用 |
---|---|
Chip size:0603~2512 / 封装大小:0603~2512 Low TCR / 低温度漂移系数 | Switching model power supply / 开关电源
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Dimensions / 外形尺寸 | ||||||
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Type 型号 | Resistance 阻值范围(mΩ) | L (mm) | W (mm) | T (mm) | A (mm) | B (mm) |
0603* | ≥5 | 1.60±0.20 | 0.80±0.20 | 0.70±0.15 | 0.35±0.20 | 0.35±0.20 |
0805 | 3~4 | 2.00±0.20 | 1.25±0.20 | 0.70±0.15 | 0.40±0.25 | 0.70±0.30 |
≥5 | 0.40±0.30 | |||||
1206 | 3~4 | 3.20±0.20 | 1.60±0.20 | 0.75±0.15 | 0.50±0.30 | 0.90±0.30 |
≥5 | 0.50±0.30 | |||||
2010 | 3 | 5.00±0.20 | 2.50±0.20 | 0.75±0.20 | 0.60±0.30 | 1.60±0.30 |
4~5 | 1.30±0.30 | |||||
﹥5 | 0.80±0.30 | |||||
2512 | 2 | 6.40±0.20 | 3.20±0.20 | 0.75±0.20 | 0.90±0.30 | 2.30±0.30 |
3 | 1.90±0.30 | |||||
4 | 1.70±0.30 | |||||
5~6 | 1.20±0.30 | |||||
7 | 1.10±0.30 | |||||
﹥7 | 0.90±0.30 |
Electrical Specifications / 电气规格 | |||||
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Part Number 型号 | Power Rating at 70℃(W) 70℃额定功率(W) | Resistance Range(mΩ) 阻值范围(mΩ) | TCR(ppm/℃) 电阻温度系数(ppm/℃) | Resistance Tolerance 阻值精度 | Operation Temp. Range 工作温度范围 |
0603 | 0.5 | 5≤ R < 10 | ±200 | ±0.5%(D) | -55℃~+170℃ |
10 ≤ R ≤ 30 | ±100 | ||||
0805 | 0.5、0.75 | 3 ≤ R<10 | ±100 | ||
0.5 | 10 ≤ R ≤ 47 | ±50 | |||
1206 | 0.5、1.0 | 3 ≤ R < 10 | ±100 | ||
10 ≤ R ≤ 68 | ±50 | ||||
2010 | 1.0 | 3 ≤ R < 10 | ±100 | ||
10 ≤ R ≤ 100 | ±50 | ||||
2512 | 2.0 | 2 | ±200 | ||
3≤R≤10 | ±100 | ||||
10 ≤ R < 100 | ±50 | ||||
1.0 | 100 ≤ R ≤ 200 | ±50 |
"*" 2512 2W applicable resistance range 2~100mΩ / 2512应用阻值范围2~100mΩ
Remark / 备注:
a.0.5 W with total solder pad trace size of 100 mm². / 0.5W功率测试时,焊垫尺寸为100 mm²。
b.0.75 W with total solder pad trace size of 200 mm². / 0.75W功率测试时,焊垫尺寸为200 mm²。
c.1.0 W with total solder pad trace size of 200 mm². / 1W功率测试时,焊垫尺寸为300 mm²。
d.2.0 W with total solder pad trace size of 300 mm². / 2W功率测试时,焊垫尺寸为300 mm²。